Our roving applications manager, Dr Giles Humpston, will be presenting a paper called: “Thermal Management for Chip-Scale Packaged Lighting Modules” at the LED Professional Symposium in Bregenz, Austria, disusing the opportunities and thermal challenges presented by chip scale packaged (CSP) LEDs. The presentation will investigate how Nanotherm LC can help Level 2 PCBA manufacturers create smaller, brighter and more efficient modules that overcome issues with power density.
The event runs 26th – 28th September. To find out more and book your tickets please visit the LED Professional website.
To find out more you can download a PDF version of our article ‘Looking for the best thermal solution for CSP module designs’ in LED Professional Magazine.