We’re presenting “Thermal Management for Chip-Scale Packaged Lighting Modules” at LED Professional Symposium, in Bregenz, Austria 26 – 28th September.

Our applications manager, Dr Giles Humpston, is presenting a paper on how the development of chip-scale packaged (CSP) LEDs is creating a major thermal headache for LED module designers, and how nanoceramic MCPCBs are uniquely positioned to address the problem.

For full details visit the LED Professional Symposium website.